Adhesive which hardens in several stages

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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Details

C156S275500, C525S458000, C522S034000, C522S035000, C522S096000

Reexamination Certificate

active

09719928

ABSTRACT:
A hotmelt adhesive having a melting point of at least 40° C. is provided which may be hardened in multiple stages and which is useful in the production of laminates. The hotmelt adhesive may contain a polymer with at least one functional group that is reactive towards a compound with an acidic hydrogen atom and with one functional group that can be polymerized by UV or electron beams, or a polymer with at least one functional group that is reactive towards a compound with an acidic hydrogen atom and with no functional group that can be polymerized by UV or electron beams. These polymers may be used in combination with a relatively low molecular compound with a functional group that can be polymerized by UV or electron beams.

REFERENCES:
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patent: 5478427 (1995-12-01), Huver et al.
patent: 5866656 (1999-02-01), Hung et al.
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Abstract of JP 05214314.
Machine translation of JP 05214314.
Abstract of EP 603046.
English translation EP603046.

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