Adhesive to attach a cooling device to a thermal interface

Heat exchange – Heat transmitter

Reexamination Certificate

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Details

C361S705000

Reexamination Certificate

active

07025129

ABSTRACT:
A method of providing thermal connection between a thermal cooling device and an integrated circuit package is provided. An adhesive is applied to a thermal interface outside a heat transfer area thereof. The thermal interface is attached to the cooling device. The device to be cooled is attached to the thermal interface.

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