Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1996-12-05
1999-05-18
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156289, B32B31/00
Patent
active
059047968
ABSTRACT:
A thermal interface facilitates heat transfer from an electronic component to a heat sink. The thermal interface has a generally planar substrate formed of a heat resistant material having a layer of adhesive formed upon one surface thereof. A layer of conformable, heat conducting material is formed upon the other surface of the substrate. The other layer of adhesive facilitates attachment of the thermal interface to either an electronic component or a heat sink, as desired. The layer of conformable heat conducting material deforms so as to enhance heat transfer from the electronic component to the heat sink.
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Flynn Gary E.
Freuler Raymond G.
Lorin Francis J.
Power Devices, Inc.
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