Adhesive tapes and semiconductor devices

Details Adhesive tapes and semiconductor devices Adhesive tapes and semiconductor devices

1990-05-24

1992-02-25

Lesmes, George F.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428 40, 428344, 428354, 4284735, 357 70, B32B 712, B32B 1504

Patent

active

050912518

ABSTRACT:
Adhesive tapes suitable for use in wire-bonded semiconductor devices are disclosed. They are each composed of a heat-resistant substrate formed of at least one layer, a copper foil provided on one side of the substrate, and a semi-cured adhesive layer and a protective film provided successively on the other side of the substrate. Semiconductor devices fabricated using such adhesive tapes are also disclosed.

REFERENCES:
patent: 4666762 (1987-05-01), Yamamoto
patent: 4861648 (1989-08-01), Kleinschmidt et al.
patent: 4892602 (1990-01-01), Oike et al.

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