Adhesive tape joining apparatus

Details Adhesive tape joining apparatus Adhesive tape joining apparatus

2008-02-12

2010-02-16

Sells, James (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

C156S494000, C156S522000, C156S542000, C156S556000

Reexamination Certificate

active

07661454

ABSTRACT:
An apparatus of this invention includes: a workpiece holding mechanism that holds a ring frame and a wafer; a tape supplying device that supplies a continuous dicing tape or a continuous carrier tape to which a precut dicing tape is joined, to a joining position; a joining unit that joins the continuous dicing tape or the precut dicing tape separated from the carrier tape, to the ring frame and the semiconductor wafer; a tape cutting mechanism that cuts the dicing tape joined to the ring frame along a contour of the ring frame; and a residual tape collecting section that takes up and collects a residual tape after the cutting.

REFERENCES:
patent: 5961768 (1999-10-01), Tsujimoto
patent: 6080263 (2000-06-01), Saito et al.
patent: 6698488 (2004-03-01), Ishinoda
patent: 7438631 (2008-10-01), Nagamoto et al.
patent: 2005-123653 (2005-05-01), None
patent: 2005-150177 (2005-06-01), None

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