Adhesive tape for electronic parts and liquid adhesive

Details Adhesive tape for electronic parts and liquid adhesive Adhesive tape for electronic parts and liquid adhesive

1996-05-03

1998-12-22

Davis, Jenna

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

Release layer

428355N, C09J 702

Patent

active

058516166

ABSTRACT:
The present invention provide a novel polyimide which is soluble in organic solvents and excels in heat resistance, and to a process for producing the polyimide. The polyimide of the present invention comprises a repeating unit represented by the formula (1) and having a number average molecular weight of from 4,000 to 200,000. ##STR1## wherein X is --SO.sub.2 -- or --C(.dbd.O)--OCH.sub.2 CH.sub.2 O--C(.dbd.O)--, and R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are independently an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms.

REFERENCES:
patent: 5508357 (1996-04-01), Matssura
patent: 5510425 (1996-04-01), Matsuura

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