Adhesive tape for electronic parts and liquid adhesive

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer

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Details

428355R, 428349, 428352, 528 26, 528353, C09J17908, H01L 2329

Patent

active

058662502

ABSTRACT:
This invention provide an adhesive tape and a liquid adhesive for electronic parts having sufficient thermal resistance and reliability. The adhesive tape comprises an adhesive layer composed of at least a polyimide comprising the repeating units represented by the formulas (1) and (2), provided on surface of a heat resistance film or a release film: ##STR1## wherein X is --SO.sub.2 -- and/or --C(.dbd.O)--OCH.sub.2 CH.sub.2 O--C(.dbd.O)--, Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1 to 10 carbon atoms or --CH.sub.2 OC.sub.6 H.sub.4 --, and n means an integer of 1 to 20.

REFERENCES:
patent: 5300627 (1994-04-01), Kunimune et al.

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