Adhesive tape for electronic parts and liquid adhesive

Details Adhesive tape for electronic parts and liquid adhesive Adhesive tape for electronic parts and liquid adhesive

1996-03-28

1997-03-11

Woodward, Ana

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428 413, 428 414, 428 418, 428212, 428354, 428447, 428451, 428483, 428511, 428355CN, B32B 710, B32B 2728

Patent

active

056099568

ABSTRACT:
Adhesive tapes which can be adhered and cured at a relatively low temperature, keeps enough electric insulation in case of adhering to the leadframe of semiconductor devices. The adhesive tape comprises a releasing film and an adhesive layer provided on a surface of said releasing film, said adhesive layer being semi-cured into a B-stage and composed of:

REFERENCES:
patent: 5446080 (1995-08-01), Shima et al.
patent: 5494757 (1996-02-01), Sakumoto et al.

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