Adhesive tape for electronic parts and liquid adhesive

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428343, 428344, 428447, 428458, 4284735, B32B 712, B32B 904, B32B 1508, B32B 2700

Patent

active

057259488

ABSTRACT:
This invention provides an adhesive tape and a liquid adhesive for electronic parts having sufficient thermal resistance and reliability. The adhesive tape of the invention comprises an adhesive layer composed of at least a polyimide selected from (I) a polyimide comprising the repeating unit represented by the following formula (1), (II) a polyimide comprising the repeating unit represented by the following formula (2), and (III) a polyimide comprising the repeating units represented by the following formulas (1) and (2) in a suitable proportion, provided on at least one surface of a heat resistance film or on a surface of a release film: ##STR1## wherein Ar is a divalent group having aromatic rings, Ra is a divalent group having 2 to 6 benzene rings; Rb is an alkylene group having 2 to 20 carbon atoms, a specific ether group or a specific dimethylsiloxane group: X.sup.1 is NH, NR (R is a C.sub.1 -C.sub.4 alkyl group or alkoxy group) or S; and X.sup.2 is NH, NR (R is a C.sub.1 -C.sub.4 alkyl group or alkoxy group), ##STR2## or S.

REFERENCES:
patent: 4904758 (1990-02-01), Kunimune et al.
patent: 4933219 (1990-06-01), Sakumoto et al.
patent: 5032438 (1991-07-01), Sakumoto et al.
patent: 5091251 (1992-02-01), Sakumoto et al.
patent: 5212279 (1993-05-01), Nomura et al.
patent: 5254412 (1993-10-01), Fujimoto
patent: 5272247 (1993-12-01), Sotokawa et al.
patent: 5277972 (1994-01-01), Sakamoto et al.
patent: 5298304 (1994-03-01), Narushima et al.
patent: 5446080 (1995-08-01), Shima et al.
patent: 5480965 (1996-01-01), Yamashita et al.
patent: 5494797 (1996-02-01), Sakumoto et al.
patent: 5508337 (1996-04-01), Yamashita et al.
patent: 5510189 (1996-04-01), Sakumoto et al.
patent: 5512628 (1996-04-01), Sakumoto et al.
patent: 5514748 (1996-05-01), Isutsumi et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Adhesive tape for electronic parts and liquid adhesive does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesive tape for electronic parts and liquid adhesive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive tape for electronic parts and liquid adhesive will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-137759

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.