Adhesive tape for electronic parts

Details Adhesive tape for electronic parts Adhesive tape for electronic parts

1998-07-17

2000-10-17

Zirker, Daniel

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428355N, 428447, 428355CN, 4284735, 528 26, 528353, B32B 712, C09J17908

Patent

active

061328650

ABSTRACT:
An adhesive tape for electronic parts which comprises a metal substrate and an adhesive layer A and an adhesive layer B laminated in order on at least one side of said metal substrate, wherein said adhesive A comprises a polyimide consisting of 100 -20% by mol of the repeating unit represented by the following formula (1a) and 0-80% by mol of the repeating unit represented by the following formula (1b), said adhesive B comprises a polyimide consisting of 100-40% by mol of the repeating unit represented by the following formula (1a) and 0-60% by mol of the repeating unit represented by the following formula (2), and the adhesive layer A and the adhesive layer B have each a different glass transition temperature: ##STR1## wherein Ar represents a divalent group selected from the specified structures containing aromatic rings, R is an alkylene group having 1 to 10 carbon atoms or --CH.sub.2 OC.sub.6 H.sub.4 --, the methylene group of which attaches to Si, and n means an integer of 1 to 20.

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patent: 5851616 (1998-12-01), Oka et al.
patent: 5866250 (1999-02-01), Oka et al.
patent: 5891540 (1999-04-01), Oka

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