Adhesive tape cutting method and apparatus using the same

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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C156S350000, C156S353000, C156S354000, C156S355000, C156S367000, C156S378000, C156S379000, C156S379600, C156S510000, C156S515000, C156S522000, C156S523000, C156S526000, C156S530000, C083S072000, C083S073000, C083S074000, C083S076100, C083S290000, C083S524000, C082S048000

Reexamination Certificate



A strip-shaped supporting adhesive tape is joined to a ring frame, and then is stuck with a cutter blade such that the cutter blade penetrates the adhesive tape. In a state where a cutting edge of the cutter blade is brought into contact with a tape joined side of the ring frame, thereafter, the adhesive tape is cut along a contour of the ring frame while electric current is fed to each of the cutter blade and the ring frame. Herein, a sensor monitors a conduction status in real time.

patent: 2788070 (1957-04-01), Seabury, II et al.
patent: 2792883 (1957-05-01), Pokorski
patent: 4653361 (1987-03-01), Zobeli
patent: 2003/0133762 (2003-07-01), Yamamoto et al.
patent: 2005/0081988 (2005-04-01), Yamamoto
patent: 62-174940 (1987-07-01), None
Lion Precision, “Eddy-Current Sensors and Inductive Sensors, Noncontact measurement of Displacement”,


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