Adhesive tape cutting method and adhesive tape joining...

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control

Reexamination Certificate

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Details

C156S064000, C156S350000, C156S378000, C156S379000, C156S510000, C156S522000, C083S048000, C083S076700, C083S076800, C083S079000, C083S080000, C083S286000, C083S289000, C083S359000, C083S365000, C083S361000

Reexamination Certificate

active

07984737

ABSTRACT:
In a state that a reference plane of a cutter holder, to which a cutter blade is attached, is brought into contact with a surface of a base of a supporting adhesive tape, the cutter blade cuts the supporting adhesive tape while the reference plane of the cutter holder follows the surface of the base. Herein, a cutting edge of the cutter blade passes by a joining interface between the supporting adhesive tape and a ring frame without penetrating through an adhesive layer of the supporting adhesive tape.

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Partial European Search Report for the Application No. EP 07 01 8477 dated Mar. 8, 2010.
European Search Report for the Application No. EP 07 01 8477 dated Aug. 5, 2010.
European Office Action for the Application No. 07 018 477.5 Apr. 5, 2011.

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