Adhesive tape attaching method

Details Adhesive tape attaching method Adhesive tape attaching method

2011-01-25

2011-01-25

Yao, Sam C (Department: 1746)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S247000, C156S293000, C156S345420

Reexamination Certificate

active

07875148

ABSTRACT:
An adhesive tape attaching method for attaching an adhesive tape to the back side of a wafer, the wafer having a device area where a plurality of devices are formed on the front side of the wafer and a peripheral marginal area surrounding the device area, wherein the back side of the wafer is formed with a circular recess corresponding to the device area and an annular reinforcing portion surrounding the circular recess so as to correspond to the peripheral marginal area. The adhesive tape attaching method includes the steps of holding the wafer and the adhesive tape in a low-pressure condition so that the back side of the wafer is opposed to the adhesive surface of the adhesive tape, fixedly providing a plate member in the condition where the plate member is opposed to the nonadhesive surface of the adhesive tape, pressing the back side of the wafer against the adhesive surface of the adhesive tape, and engaging the plate member into the circular recess formed on the back side of the wafer in the condition where the adhesive tape is closely fitted in the circular recess.

REFERENCES:
patent: 2003/0173017 (2003-09-01), Hecht et al.
patent: 2007/0045799 (2007-03-01), Sekiya
patent: 2007/0218648 (2007-09-01), Ishizuka et al.
patent: 6-177243 (1994-06-01), None
patent: 2005-135931 (2005-05-01), None
patent: 2007-19461 (2007-01-01), None

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