Adhesive tape

Details Adhesive tape Adhesive tape

2006-11-14

2006-11-14

Feely, Michael J. (Department: 1712)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C428S3550RA, C428S3550AC, C428S413000

Reexamination Certificate

active

07135224

ABSTRACT:
An adhesive tape comprising a base and, superimposed thereon, an adhesive layer, this adhesive layer comprising an adherent component (A), an epoxy resin (B), a thermally active latent epoxy resin curing agent (C), an energy radiation polymerizable compound (D) and a photopolymerization initiator (E), wherein either or both of the epoxy resin (B) and energy radiation polymerizable compound (D) have a dicyclopentadiene skeleton in its molecule or molecules thereof. The resultant adhesive tape has an adhesive layer which provides reduced water absorption of an adhesive curing product and which enables a lowering of the elastic modulus thereof during thermocompression bonding.

REFERENCES:
patent: 4612209 (1986-09-01), Forgo et al.
patent: 5110388 (1992-05-01), Komiyama et al.
patent: 6303219 (2001-10-01), Sawamura et al.
patent: 6727334 (2004-04-01), Nishiwaki et al.
patent: 2200021 (1973-07-01), None
patent: 55-145726 (1980-11-01), None
patent: 60-196956 (1985-10-01), None
patent: 60-223139 (1985-11-01), None
patent: 02-032181 (1990-02-01), None
patent: WO 00/47666 (2000-08-01), None
Abstract of JP 08-053655, provided by the JPO website.

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