Adhesive systems comprising a bisamino piperazine-containing pol

Details Adhesive systems comprising a bisamino piperazine-containing pol Adhesive systems comprising a bisamino piperazine-containing pol

1976-09-20

1978-04-04

Rzucidlo, Eugene C.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 18PN, 260 18EP, 260 2N, 260 47EN, 260 78R, 260830P, 260268C, 2604045, C08G 5944

Patent

active

040827089

ABSTRACT:
The disclosed adhesive system comprises a curable liquid epoxide and a bisamino piperazine-containing thermoplastic polyamide hardener or co-curative. This adhesive system forms high strength metal-to-metal bonds with unusually high T-peel strength, high tensile shear strength, excellent low temperature properties, and good impact resistance while possessing the fast assembly speed characteristics of a hot melt. Both two-part and stable one-part curable systems can be formulated from (a) suitable epoxy resins and (b) the bisamino piperazine-containing thermoplastic polyamide.
The particularly preferred polyamide comprises the amidification product, at temperatures of from 180.degree. C. to 300.degree. C., of:

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Advance Technical Data (Bis(Aminopropyl)Piperazine) Jefferson Chem. Co., July 1974.

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