Adhesive sheet for wafer setting and process for producing elect

Stock material or miscellaneous articles – Circular sheet or circular blank – Aperture containing

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428157, 428212, 428213, 428354, 156344, 156584, 438464, 438976, B32B 302

Patent

active

060429224

ABSTRACT:
An adhesive sheet for wafer setting, comprising a wafer setting part composed of an expansible film and an adhesive layer for wafer setting and a marginal part outside the wafer setting part,

REFERENCES:
patent: 5705016 (1998-01-01), Senoo et al.
Japanese Publication No. 02265258, Abstract, Oct. 30, 1990, 1 p., English language.
Japanese Publication No. 05299504, Abstract, Nov. 12, 1993, 1 p., English language.

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