Adhesive sheet for processing semiconductor substrates

Details Adhesive sheet for processing semiconductor substrates Adhesive sheet for processing semiconductor substrates

2011-05-17

2011-05-17

Shosho, Callie E (Department: 1787)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C428S343000, C428S3550BL, C428S3550AC, C524S560000

Reexamination Certificate

active

07943235

ABSTRACT:
An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer is formed using a multifunctional acrylate oligomer and/or monomer having a double bond, and is blended so as to result in 1 double bond per total average molecular weight of 225 to 8000 as determined on the basis of the weight average molecular weight of the multifunctional acrylate oligomer and/or monomer.

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Satas, Donatas. “The Handbook of Pressure Sensitive Adhesive Technology,” 1999, Satas & Associates, p. 484.
Japanese Office Action corresponding to JP 2007-000359, mailed Feb. 8, 2011.

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