Adhesive resin composition and bonding method

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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Details

C525S330100, C525S403000, C525S460000, C525S436000, C156S331700, C156S327000

Reexamination Certificate

active

08062469

ABSTRACT:
The present invention relates to an inexpensive adhesive resin composition which is applicable even to a base material having a poor bonding property. The adhesive resin composition comprises (A) a polymer having no radical-polymerizable double bond and (B) a radical generating agent in which the radical generating agent (B) is present in an amount of 0.1 to 10 parts by weight on the basis of 100 parts by weight of the polymer (A). In the preferred embodiment of the present invention, the adhesive resin composition further comprises (C) a radical-polymerizable monomer wherein the monomer (C) is present in an amount of 0.1 to 10 parts by weight on the basis of 100 parts by weight of the polymer (A). The radical-polymerizable monomer (C) is a glycidyl group-containing monomer, and the glycidyl group-containing monomer is 4-hydroxybutyl acrylate glycidyl ether.

REFERENCES:
patent: 6121378 (2000-09-01), Miyawaki et al.
patent: 2004/0222408 (2004-11-01), Watanabe et al.
patent: 11-284024 (1999-10-01), None
patent: 2005-206717 (2005-08-01), None
patent: 2006-342222 (2006-12-01), None
patent: 2007-258508 (2007-10-01), None
International Search Report for PCT/JP2008/000137, mailed Mar. 25, 2008.

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