Adhesive resin composition and adhesive agent in film form,...

Details Adhesive resin composition and adhesive agent in film form,... Adhesive resin composition and adhesive agent in film form,...

2004-04-13

2009-02-10

Woodward, Ana L (Department: 1796)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C257S783000, C257SE23090, C428S3550EP, C428S3550EN, C428S901000, C438S106000, C438S118000

Reexamination Certificate

active

07488532

ABSTRACT:
The present invention is to provide an adhesive resin composition for use in preparing an adhesive in the form of a film which is excellent in the adhesiveness at a low temperature and in the heat resistance, an adhesive in the form of a film comprising the adhesive resin composition, and a semiconductor device using the adhesive in the form of a film.

REFERENCES:
patent: 5406124 (1995-04-01), Morita et al.
patent: 6693162 (2004-02-01), Tsuji et al.
patent: 2003/0045669 (2003-03-01), Tsuji et al.
patent: 05-331444 (1993-12-01), None
patent: 6-200218 (1994-07-01), None
patent: 2996857 (1995-09-01), None
patent: 9-59589 (1997-03-01), None
patent: 11-92744 (1999-04-01), None
patent: 2001-311053 (2001-11-01), None
patent: 2001-348556 (2001-12-01), None
patent: 2002-069420 (2002-03-01), None
patent: 2003-027014 (2003-01-01), None
patent: 2003-027034 (2003-01-01), None

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