Adhesive resin composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

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524476, 524477, 524481, 524482, 524483, 524484, 524485, 524486, 524504, 524505, 525 71, 525 98, C08L 9304

Patent

active

055917925

ABSTRACT:
The invention relates to an adhesive resin composition comprising an ethylene polymer having a melting point of 70 to 132.degree. C., a density of 0.88 to 0.94% g/cm.sup.3 and a melt flow rate (MFR) of 0.05 to 50 g/10 min. and/or a modified product thereof with an unsaturated carboxylic acid or its derivative (component A); a tackifier (component B); and a block copolymer containing at least one polymer block mainly composed of a vinyl aromatic hydrocarbon and at least one polymer block mainly composed of a conjugated diene or a hydrogenated product thereof (component C). This composition is useful as an adhesives showing excellent adhesion over a wide temperature range as well as processability by film molding, sheet molding, blow molding, etc. It is available for laminates comprising various kinds of resins such as polyolefins, styrenic resins, polyesters, acrylic resins and polyamides.

REFERENCES:
patent: 4918730 (1990-04-01), Kano et al.
patent: 5206284 (1993-04-01), Fukui et al.
patent: 5264476 (1993-11-01), Daimon et al.
patent: 5286781 (1994-02-01), Gotoh et al.

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