Rotary expansible chamber devices – With mechanical sealing
Patent
1986-02-12
1987-10-13
Vrablik, John J.
Rotary expansible chamber devices
With mechanical sealing
418131, 418206, 277 27, 277205, 384291, 384400, F04C 218, F04C 1300, F16C 3310, F16J 1524
Patent
active
046995757
ABSTRACT:
An improved adhesive pump and pump control system for automatically changing the flow rate of adhesive materials being dispensed onto a workpiece in conformance with changes in movement of a robot controlled adhesive dispensing nozzle used to apply adhesive materials automatically onto the surface of the workpiece in accordance with a predetermined pattern. The system includes an improved adhesive gear pump having a novel sealing arrangement which employs lubricant grease supplied under pressure for preventing leakage of the adhesive along the shaft into the bearings of the pump thereby assuring long and reliable operating life for the pump under normal operating conditions.
REFERENCES:
patent: 1961029 (1934-05-01), Benedek
patent: 1972565 (1934-09-01), Kempton
patent: 2547374 (1951-04-01), Carideo
patent: 2957428 (1960-10-01), Meyer et al.
patent: 2986096 (1961-05-01), Booth et al.
patent: 2988009 (1961-06-01), Kraissl, Jr.
patent: 3173374 (1965-03-01), Beimfohr
patent: 3528756 (1970-09-01), Norlin et al.
patent: 3830602 (1974-08-01), Boop et al.
patent: 4174846 (1979-11-01), Scott
patent: 4336213 (1982-06-01), Fox
patent: 4381127 (1983-04-01), Visser
patent: 4431690 (1984-02-01), Matt et al.
patent: 4564410 (1986-01-01), Clitheros et al.
patent: 4584964 (1986-04-01), Engel
Crotty C. Alan
Geisel Donald J.
Pilarski Richard J.
Helzer Charles W.
Robotics, Inc.
Vrablik John J.
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