Stock material or miscellaneous articles – Composite – Of polyimide
Reexamination Certificate
2005-05-03
2005-05-03
Hightower, P. Hampton (Department: 1711)
Stock material or miscellaneous articles
Composite
Of polyimide
C428S411100, C428S447000, C428S457000, C428S458000, C528S026000, C528S028000, C528S125000, C528S126000, C528S128000, C528S170000, C528S172000, C528S173000, C528S176000, C528S179000, C528S183000, C528S185000, C528S220000, C528S229000, C528S350000, C528S353000, C264S212000, C264S241000, C264S298000, C264S299000, C264S319000, C427S210000, C427S307000, C156S060000
Reexamination Certificate
active
06887580
ABSTRACT:
An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 250□C and a Young's modulus (storage modulus) at 250□C of 105Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 270□C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts.
REFERENCES:
patent: 5241041 (1993-08-01), Choi et al.
patent: 5932345 (1999-08-01), Furutani et al.
patent: 6350844 (2002-02-01), Ono et al.
patent: 6538093 (2003-03-01), Sugo et al.
patent: 6693162 (2004-02-01), Tsuji et al.
patent: 20010031828 (2001-10-01), Honda et al.
patent: 0 676 456 (1999-03-01), None
patent: 0547555 (1999-06-01), None
patent: 01948992 (2002-12-01), None
patent: 05-181274 (1993-07-01), None
patent: 05-247211 (1993-09-01), None
patent: 08-034968 (1996-02-01), None
patent: 08-218034 (1996-08-01), None
patent: 11-228825 (1999-08-01), None
patent: 11-310754 (1999-11-01), None
International Search Report PCT/JP01/00549 mailed on May 1, 2001.
Translation of International Search Report mailed on Aug. 27, 2002.
Kaneko Kazuaki
Tokuhisa Kiwamu
Tokumitsu Akira
Hampton Hightower P.
Nippon Steel Chemical Co. Ltd.
Rader & Fishman & Grauer, PLLC
LandOfFree
Adhesive polyimide resin and adhesive laminate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Adhesive polyimide resin and adhesive laminate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive polyimide resin and adhesive laminate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3375417