Adhesive polyamide resin compositions containing high acid numbe

Chemistry of carbon compounds – Miscellaneous organic carbon compounds

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260 18N, 260857L, 260857UN, C09J 314

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active

041326903

ABSTRACT:
Adhesive polyamide resin compositions, such as hot melts, containing conventional components are improved by inclusion of a normally solid, homogeneous copolymer of ethylene and an unsaturated carboxylic acid having an acid number of at least about 100 and a number average molecular weight between 500 and 5,000.

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patent: 3646154 (1972-02-01), Marans et al.
patent: 3658741 (1972-04-01), Knutson et al.
patent: 3676400 (1972-07-01), Kohan et al.
patent: 3787342 (1974-01-01), Berry et al.
patent: 3868433 (1975-02-01), Bartz et al.

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