Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Patent
1999-03-09
2000-12-26
Morris, Terrel
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Adhesive outermost layer
428355EP, 524403, B32B 1504, B32B 712, C08K 310
Patent
active
061656135
ABSTRACT:
This invention is an adhesive paste that consists essentially of a polymeric resin in particulate form and a carrier for the resin. The polymeric resin is present as particles with a particles size of 50 microns or smaller, is insoluble in the carrier at ambient temperature, and is soluble in the carrier at a temperature above ambient temperature. The carrier either reacts with the resin to form a covalent bond, or vaporizes from the adhesive paste, at a temperature above the temperature at which the resin is soluble in the carrier. The paste contains no inorganic fillers, holds its geometry on application, and fuses to a void-free bond.
REFERENCES:
patent: 4933030 (1990-06-01), Dietz
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5391604 (1995-02-01), Dietz et al.
patent: 5488082 (1996-01-01), Dietz et al.
Krieger Gregory
Kuder Richard
Puglisi Christine
Shenfield David
Xiao Chaodong
Dean Frederick G.
Gennaro Jane E.
Morris Terrel
National Starch and Chemical Investment Holding Corporation
LandOfFree
Adhesive paste for semiconductors does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Adhesive paste for semiconductors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive paste for semiconductors will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-992433