Adhesive pad with a shrinkable layer

Details Adhesive pad with a shrinkable layer Adhesive pad with a shrinkable layer

1991-07-08

1993-03-23

Kalafut, Stephen

Chemistry: electrical current producing apparatus, product, and

Current producing cell, elements, subcombinations and...

Separator, retainer or spacer insulating structure

429186, 428346, 428352, H01M 210

Patent

active

051962802

ABSTRACT:
An adhesive pad (100) is provided which has a shrinkable member (130) disposed on an adhesive member, including a film (110), and an adhesive layer (120). The shrinkable member (130) is responsive to heat to expose a portion of an adhesive surface (126) in response to heat.

REFERENCES:
patent: 4469742 (1984-09-01), Oberle et al.
patent: 4545639 (1985-10-01), Holden
patent: 4554226 (1985-11-01), Simonton
patent: 4596732 (1986-06-01), Diaz
patent: 4844973 (1989-07-01), Konishi et al.
patent: 4911994 (1990-03-01), Will et al.
patent: 4993974 (1991-02-01), Selinko

Affiliated with

Also associated with

Rating

Adhesive pad with a shrinkable layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesive pad with a shrinkable layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive pad with a shrinkable layer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1350726