Adhesive of epoxy resins, epoxy-modified polybutadiene and photo

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...

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Details

522170, 428246, 428901, 525524, C08G 5906, C08L 6302, C08L 6308

Patent

active

054038693

ABSTRACT:
An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy-modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple-wire wiring boards having good heat resistance, solvent resistance and wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.

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patent: 5310840 (1994-05-01), Willett et al.
Derwent accession No. 87-69223/10 for Japanese Patent No. 62-23043, Jan. 31, 1987, Konishiroku Photo Ind. co., Ltd.
Derwent accession No. 86-202429/31 for Japanese Patent No. 61-136563, Jun. 24, 1984, Toyo Ink Mfg.

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