Adhesive of epoxy resin, nitrile rubbers and curing agent

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

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Details

523434, 523457, 525108, C08K 322, C08L 6302, C08L 6304

Patent

active

060545097

ABSTRACT:
Provided by the invention is a thermosetting adhesive composition suitable for use in the preparation of metal foil-laminated base sheets of flexible printed circuit boards and laminated product related thereto such as coverlay films and bonding sheets. The adhesive composition is a uniform blend which comprises: (A) an epoxy resin including a brominated epoxy resin to exhibit flame retardancy; (B) a combination of two or three kinds of different nitrile rubbers distinguishable relative to the iodine value and content of carboxyl groups at the molecular chain ends in a specified weight proportion; (C) a curing agent for the epoxy resin; and (D) a curing accelerator, with optional admixture of (E) an inorganic filler; and/or (F) a vulcanizing agent for the nitrile rubbers.

REFERENCES:
patent: 5260130 (1993-11-01), Sakaguchi et al.
patent: 5783625 (1998-07-01), Mori et al.
patent: 5859155 (1999-01-01), Furihata et al.

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