Adhesive of a silicon and silica composite for bonding...

Stock material or miscellaneous articles – Composite – Of silicon containing

Reexamination Certificate

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C206S454000, C211S041180, C428S426000, C428S428000, C428S448000, C432S258000

Reexamination Certificate

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07666513

ABSTRACT:
A method of joining two silicon members, the adhesive used for the method, and the joined product, especially a silicon tower for supporting multiple silicon wafers. A flowable adhesive is prepared comprising silicon particles of size less than 100 μm and preferably less than 100 nm and a silica bridging agent, such as a spin-on glass. Nano-silicon crystallites of about 20 nm size may be formed by CVD. Larger particles may be milled from virgin polysilicon. If necessary, a retardant such as a heavy, preferably water-insoluble alcohol such as terpineol is added to slow setting of the adhesive at room temperature. The mixture is applied to the joining areas. The silicon parts are assembled and annealed at a temperature sufficient to link the silica, preferably at 900° C. to 1100° C. for nano-silicon but higher for milled silicon.

REFERENCES:
patent: 3273957 (1966-09-01), Beredjick
patent: 3707386 (1972-12-01), Kurz
patent: 3833348 (1974-09-01), Stokes et al.
patent: 4541035 (1985-09-01), Carlson et al.
patent: 5795813 (1998-08-01), Hughes et al.
patent: 5945475 (1999-08-01), Yamada et al.
patent: 6004866 (1999-12-01), Nakao et al.
patent: 6051452 (2000-04-01), Shigyo et al.
patent: 6056123 (2000-05-01), Niemirowski et al.
patent: 6099302 (2000-08-01), Hong et al.
patent: 6145673 (2000-11-01), Burrows et al.
patent: 6157047 (2000-12-01), Fujita et al.
patent: 6225154 (2001-05-01), Allman
patent: 6239004 (2001-05-01), Aga et al.
patent: 6450346 (2002-09-01), Boyle et al.
patent: 6455395 (2002-09-01), Boyle et al.
patent: 6528391 (2003-03-01), Henley et al.
patent: 6544864 (2003-04-01), Reeder et al.
patent: 6603651 (2003-08-01), Kosakai et al.
patent: 6787195 (2004-09-01), Wang et al.
patent: 6832716 (2004-12-01), Canham et al.
patent: 2001/0000335 (2001-04-01), Yamada et al.
patent: 2002/0149082 (2002-10-01), Nagano et al.
patent: 55-163702 (1980-12-01), None
patent: 05-175319 (1993-07-01), None
Pauthe et al., “Preperation and Charachterization of Si nanocrystallites embedded in a silica matrix” J. Matr. Chem., 1999, Issue 9, pp. 187-191.
Nicklaw et al., “Defects and Nanocrystals Generated by Si Implantation into a-SIO2”. Transactions on Nuclear Science, col. 47, No. 6, pp. 2269-2275. (2000).
Yamada et al. “SOI by Wafer Bonding with Spin-on-Glass as Adhesive”, Electronic Letters. col. 23. nol. 1. pp. 39-40. (1987).
Wang et al. “Gettign Highefficiency photoluminescence from Si-Nanocrystals in SiO2 matrix” Applied Physics Letters. vol. 41. No. 22., (Nov. 2002).
Lin et al., “Impact of PECVD oxide charchteristics of interconnect via resistance and device performance of four transitor static random access memory with polysilicon load resistors”. J.Vac.Sci. Technol. B. vol.17., issue 4, pp. 1456-1463. (1999).
Shimizu-Iwayama et al. “Correlation of Microstructure and Photoluminescence for Nanometer-Sized Si Crystals Formed in an Amorphous SiO2 Matrix by Ion Implantation” NanoStructured Materials, vol. 5, No. 3, pp. 307-318. (1995).
Lowery et al., “Cutting large optics costs with planform bonding”,Photonics Spectra, Apr. 1992, pp. 159-161.
Mark J. Loboda et al., “Understanding hydrogen silsesquioxane-based dielectric film processing”,Solid State Technology, May 1998, pp. 1-4.
“Nanotoxicity of nanomaterials?”,Chemistry, Autumn 2003, p. 5.

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