Adhesive, method of connecting wiring terminals and wiring...

Details Adhesive, method of connecting wiring terminals and wiring... Adhesive, method of connecting wiring terminals and wiring...

2007-07-10

2007-07-10

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S118000, C524S730000, C252S512000

Reexamination Certificate

active

11074718

ABSTRACT:
This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

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