Adhesive metallization of polyimide

Details Adhesive metallization of polyimide Adhesive metallization of polyimide

1982-12-13

1985-05-14

Lawrence, Evan K.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

156668, 204 30, 427306, 427307, 4284735, 428675, 428936, B32B 1508, B05D 310, C25D 554

Patent

active

045172544

ABSTRACT:
A process for the adhesive metallization of polyimide through pretreating of the polyimide and subsequent activation, as well as chemical metallization, if necessary, followed by galvanic metal deposition, characterized in that the polyimide is pretreated with an aqueous solution of alkali hydroxide and an organic nitrogen compound such as one selected from the group consisting of N,N,N', N'-tetra-(2-hydroxypropyl)-ethylenediamine, ethylenediaminetetraacetic acid and nitrilotriacetic acid. The plastics metallized according to the present invention find use as shaped parts, preferably in the fields of electrical engineering and electronics.

REFERENCES:
patent: 3770528 (1973-11-01), Hermes
patent: 3791848 (1974-02-01), De Angelo
patent: 4078096 (1978-03-01), Redmond et al.

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