Adhesive metallic alloys and methods of their use

Metal fusion bonding – Process – Bonding nonmetals with metallic filler

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Details

228122, B23K 100, B23K 3526

Patent

active

051315823

ABSTRACT:
A unique class of adhesive alloys and bonding methods for their use are provided which enable the user to join non-conductive materials to themselves or to electrically conductive materials. The bonding alloys have enhanced wetting properties and a melting point less than 100.degree. C. in all instances. The bonding alloys are unusual and advantageous in that they create an intimate, direct, and enduring contact between the materials while minimizing mechanical and chemical stresses.

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patent: 3323912 (1967-06-01), Bolda
patent: 3374093 (1968-03-01), King
patent: 4966142 (1990-10-01), Zimmerman

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