Metal fusion bonding – Process – Bonding nonmetals with metallic filler
Patent
1990-12-19
1992-07-21
Ramsey, Kenneth J.
Metal fusion bonding
Process
Bonding nonmetals with metallic filler
228122, B23K 100, B23K 3526
Patent
active
051315823
ABSTRACT:
A unique class of adhesive alloys and bonding methods for their use are provided which enable the user to join non-conductive materials to themselves or to electrically conductive materials. The bonding alloys have enhanced wetting properties and a melting point less than 100.degree. C. in all instances. The bonding alloys are unusual and advantageous in that they create an intimate, direct, and enduring contact between the materials while minimizing mechanical and chemical stresses.
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patent: 4966142 (1990-10-01), Zimmerman
Kaplan Alvaro
Zimmerman George O.
Prashker David
Ramsey Kenneth J.
Trustees of Boston University
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