Drug – bio-affecting and body treating compositions – Preparations characterized by special physical form – Web – sheet or filament bases; compositions of bandages; or...
Patent
1998-06-26
1999-09-28
Page, Thurman K.
Drug, bio-affecting and body treating compositions
Preparations characterized by special physical form
Web, sheet or filament bases; compositions of bandages; or...
424447, 424448, 424401, 514474, 514458, A61F 1302
Patent
active
059584475
ABSTRACT:
The invention provides adhesive matrix type transdermal patches and methods for manufacturing the patches. More specifically, the invention utilizes ordinary, prefabricated, commercially available, pressure-sensitive adhesive tapes with skin compatible adhesives, as the structural part of the patch. The adhesive matrix layer of the tape is loaded with the desirable active substances either by embedding, in the case of powders, the active substances in an adhesive matrix layer by the application of heat or pressure, or by a diffusion process for active substances comprising liquids/semi-liquids are carried in located in an embossed release liner or backing layer, which are contact laminated to the adhesive matrix by pressure, or by the utilizing of conventional printing processes to print a half-tone pattern of a bioactive liquid on the adhesive matrix.
REFERENCES:
patent: 4915950 (1990-04-01), Miranda et al.
patent: 5132115 (1992-07-01), Wolter et al.
patent: 5785978 (1998-07-01), Porter et al.
Haralambopoulos Constantine
Ryan Paul
Channavajjala Lakshmi
Page Thurman K.
PLC Holding, L.L.C.
LandOfFree
Adhesive matrix type transdermal patch and method of manufacturi does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Adhesive matrix type transdermal patch and method of manufacturi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive matrix type transdermal patch and method of manufacturi will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-700366