Adhesive for semiconductor devices and adhesive tape using the a

Details Adhesive for semiconductor devices and adhesive tape using the a Adhesive for semiconductor devices and adhesive tape using the a

1995-02-01

1998-07-28

Acquah, Samuel A.

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

Ornamental, decorative, pattern, or indicia

528129, 528153, 525420, 525427, 525429, 428 42, 428344, 428349, 428354, 428355, 4284744, A21H 1900, C09J 702

Patent

active

057860556

ABSTRACT:
An adhesive for semiconductor device, comprising (a) a polyamide resin having an amine value of 20 to 60 and a weight average molecular weight of 1,000 to 5,000 and (b) a phenolic compound having a weight average molecular weight of 2,000 or less and having a skeleton containing at least 2 methylol groups.

REFERENCES:
patent: 5290614 (1994-03-01), Narushima et al.
patent: 5298304 (1994-03-01), Narushima et al.
patent: 5523137 (1996-06-01), Sei et al.

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