Adhesive for semiconductor device and reinforcing material using

Details Adhesive for semiconductor device and reinforcing material using Adhesive for semiconductor device and reinforcing material using

1996-01-30

1998-01-13

Woodward, Ana

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428349, 428354, 428355EP, 428355N, B32B 712, B32B 1504

Patent

active

057077304

ABSTRACT:
An adhesive for bonding a reinforcing sheet to a lead-formed surface of a tape carrier package used for forming a semiconductor device, the adhesive being a resin composition which constitutes an interlayer between the lead-formed surface and the reinforcing sheet, comprises a polyamide resin having an amine value of 3.0 to 50 and an epoxy resin, is free from peeling and foaming, undergoes sufficient softening and curing at a temperature lower than about 150.degree. C., has high insulation reliability after cured, and has heat resistance against a temperature up to 260.degree. C.

REFERENCES:
patent: 4162931 (1979-07-01), Yeakey et al.
patent: 5084525 (1992-01-01), Akutagawa et al.
patent: 5296556 (1994-03-01), Frilart
patent: 5317062 (1994-05-01), Yagi et al.
patent: 5439986 (1995-08-01), Hosogane et al.
Patent Abstracts of Japan, vol. 14, No. 156(E-0908), 26 Mar. 1990 & JP-A-02015644 (Tomoegawa Paper Co Ltd) 19 Jan. 1990; abstract.
Patent Abstract of Japan; vol. 17, No. 310 (E-1380), 14 Jun. 1993 & JP-A-05029398 (Tomoegawa Paper Co Ltd), 5 Feb. 1993; abstract.
Patent Abstracts of Japan; vol. 17, No. 310 (E-1380), 14 Jun. 1993 & JP-A-05029385 (Matsushita Electric Ind Co Ltd), 5 Feb. 1993; abstract.
Patent Abstracts of Japan; vol. 17, No. 310 (E-1380), 14 Jun. 1993 & JP-A-05029399 (Tomoegawa Paper Co Ltd.) 5 Feb. 1993; abstract.
Patent Abstracts of Japan; vol. 18, No. 20 (E-1489), 13 Jan. 1994 & JP-A-05259228 (Tomoegawa Paper Co Ltd) 8 Oct. 1993; abstract.
Patent Abstracts of Japan; vol. 18, No. 80 (E-1505), 9 Feb. 1994 & JP-A-05291356 (Tomoegawa Paper Co Ltd) 5 Nov. 1993; abstract.

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