Adhesive for printed wiring board and production thereof

Details Adhesive for printed wiring board and production thereof Adhesive for printed wiring board and production thereof

1994-09-29

1995-05-30

Hamilton, III, Thomas

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

427 98, 427306, 428355, 428901, 524508, 525109, 525152, B05D 512, B05D 310, B32B 516

Patent

active

054199468

ABSTRACT:
An adhesive composition containing a special internal mold release agent obtained from tri-, di-, or mono-alkyl phosphoric ester, said alkyl moiety having 6 to 18 carbon atoms, and an amine in addition to major components of an epoxy resin, acrylonitrile-butadiene rubber, an alkylphenol resin, and an inorganic filler is suitable for producing printed wiring boards by an additive process excellent in adhesiveness to plated copper.

REFERENCES:
patent: 3691289 (1972-09-01), Rohloff
patent: 4457952 (1984-07-01), Kawamoto et al.
patent: 5053280 (1991-10-01), Takanezawa et al.
patent: 5356698 (1994-10-01), Kawamoto et al.

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