Adhesive for printed circuit boards based on epoxy resins, hydro

Details Adhesive for printed circuit boards based on epoxy resins, hydro Adhesive for printed circuit boards based on epoxy resins, hydro

1989-11-17

1992-11-10

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

528 91, 528103, 528110, 528112, 528113, 528120, 528121, 528123, 528124, 528393, 525117, 525118, 525119, 525120, 525121, 525122, 525502, 523400, 428901, C09J 316, C09J 312, B32B 1508

Patent

active

051624397

ABSTRACT:
In an adhesive for printed circuit boards, whose main components are an epoxy resin and a polymer rubber, the improvement wherein the polymer rubber is a hydrogenated conjugated diene polymer rubber having not more than 100 ppm of metal content, not more than 100 ppm of ion content as determined by ion chromatography, and an iodine value of not more than 120.

REFERENCES:
patent: 4113914 (1978-09-01), Doss
patent: 4593070 (1986-01-01), Oyama et al.
patent: 4632960 (1986-12-01), Sato et al.
patent: 4786675 (1988-11-01), Iwata et al.

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