Adhesive for printed circuit board

Details Adhesive for printed circuit board Adhesive for printed circuit board

1994-11-14

1996-11-05

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156330, 174258, 174259, C09J16300

Patent

active

055713653

ABSTRACT:
An adhesive for a printed circuit board which consists essentially of a dispersion of a resin which is soluble in an alkaline oxidizing agent after curing in a resin matrix which is sparingly soluble in an alkaline oxidizing agent after curing, and a process for producing a printed circuit board using the above adhesive.

REFERENCES:
patent: 4601784 (1986-07-01), Krulik
patent: 4752499 (1988-06-01), Enomoto
patent: 4948630 (1990-08-01), Courduvelis et al.
patent: 5021472 (1991-06-01), Enomoto
patent: 5055321 (1991-10-01), Enomoto et al.
patent: 5212261 (1993-05-01), Stierman
patent: 5344893 (1994-09-01), Asai et al.
patent: 5418264 (1995-05-01), Obloh et al.
patent: 5447996 (1995-09-01), Asai et al.
patent: 5519177 (1996-05-01), Wang et al.

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