Adhesive for printed circuit board

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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Details

428206, 428261, 525510, 525518, 525934, 525935, B32B 300, B32B 706, C08F28300, C09J16120

Patent

active

056885830

ABSTRACT:
There are disclosed an adhesive obtained by dispersing a cured amino resin fine powder soluble in acid or oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent when being subjected to a curing treatment as well as a printed circuit board using this adhesive and a method of producing the same. The adhesive has excellent properties such as resistance to chemicals, heat resistance, electric properties, hardness and adhesion property owing to the use of the amino resin fine powder. Therefore, the printed circuit board using such an adhesive is not influenced by service circumstance and is high in the connection reliability without forming short circuit between patterns. Furthermore, in the method of producing the printed circuit board, the adhesive is provided in form of a sheet or a prepreg, whereby the printed circuit board can be produced easily and cheaply.

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Moore, J.A., Editor, "Macromolecular Synthese", Methods for the Preparation of Macromolecules, Collective vol. 1, pp. 257-264, 1977.
"Resin Technique for Coating", Kogyo Chosakai Publishing Co., Ltd., p. 272, 1986.

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