Surgery – Means for introducing or removing material from body for... – Treating material introduced into or removed from body...
Reexamination Certificate
2011-06-28
2011-06-28
Feely, Michael J (Department: 1761)
Surgery
Means for introducing or removing material from body for...
Treating material introduced into or removed from body...
C604S187000, C604S192000, C604S199000, C604S218000, C525S524000, C525S533000, C523S457000, C523S458000, C156S330000, C156S330900
Reexamination Certificate
active
07967796
ABSTRACT:
The present invention inhibits the occurrence of the foreign matters attributable to an adhesive for bonding an injection needle to a needle-base member so as to enhance the yield of a syringe when producing the same. A front-assembly (3) additionally provided at a leading end of an injection cylinder (2) comprises an injection needle (4), a needle-base member (5), a connection hub (6) and a protector cap (7). The injection needle (4) and the needle-base member (5) are fixed to each other with an epoxy adhesive (19). This adhesive (19) contains denatured aliphatic epoxy resin in the amount set to about 10 to about 25 wt % and its viscosity is set to about 20000 to about 40000 mPa·s. This adhesive (19) is heated at a temperature of at least 130 degrees C. for about 20 minutes to cure it. After the front-assembly (3) and the injection cylinder (2) have been sterilized with vapor, the connection hub (6) has a connection portion (17) external fitted and secured to the leading end of the injection cylinder (2).
REFERENCES:
patent: 3390678 (1968-07-01), Bradley et al.
patent: 4308311 (1981-12-01), Ogawa et al.
patent: 4795445 (1989-01-01), Jensen
patent: 5358491 (1994-10-01), Johnson et al.
patent: 57-14437 (1982-01-01), None
patent: 59-204675 (1984-11-01), None
patent: 64-64670 (1989-03-01), None
patent: 10-25391 (1998-01-01), None
patent: 11-302358 (1999-11-01), None
patent: 2002-146321 (2002-05-01), None
patent: 2004-323589 (2004-11-01), None
Abstract of JP 59-204675 A, provided by the JPO website (no date).
Research Disclosure 42620: “Epoxy polyamide compositions for flexible circuits”, disclosed anonymously (Oct. 1999).
Translation of JP 59-204675 A, provided by the USPTO translations branch (no date).
International Search Report issued Oct. 3, 2006 in the International (PCT) Application of which the present application is the U.S. National Stage.
Kato Masahiko
Kishimoto Jotaro
Sakurai Yuusuke
Yoshikawa Hiroshi
Feely Michael J
Takeda Pharmaceutical Company
Wenderoth , Lind & Ponack, L.L.P.
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