Adhesive for electroless plating, printed circuit boards and met

Details Adhesive for electroless plating, printed circuit boards and met Adhesive for electroless plating, printed circuit boards and met

1994-06-03

1996-12-31

Davis, Jenna

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428356, 523427, 523428, 525396, 525407, C09J 702

Patent

active

055892558

ABSTRACT:
An adhesive for electroless plating is formed by dispersing particular heat-resistant granules easily soluble in an oxidizing agent into a particular heat-resistant resin sparingly soluble in the oxidizing agent through a curing treatment. A printed circuit board is manufactured by using such an adhesive.

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