Adhesive for electroless plating, printed circuit boards and met

Details Adhesive for electroless plating, printed circuit boards and met Adhesive for electroless plating, printed circuit boards and met

1989-04-28

1991-10-08

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 96, C23C 2600

Patent

active

050553216

ABSTRACT:
An adhesive for electroless plating is formed by dispersing particular heat-resistant granules easily soluble in an oxidizing agent into a particular heat-resistant resin sparingly soluble in the oxidizing agent through a curing treatment. A printed circuit board is manufactured by using such an adhesive.

REFERENCES:
patent: 4152477 (1979-05-01), Haruta
patent: 4216246 (1980-08-01), Iwasaki et al.
patent: 4457951 (1984-07-01), D'Amico
patent: 4642161 (1987-02-01), Akahoshi
patent: 4707394 (1987-11-01), Chant
patent: 4752499 (1988-06-01), Enomoto
English Abstracts for Japanese Publications 61-276875 and 53-140344.

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