Adhesive for electroless plating and method of preparation of ci

Details Adhesive for electroless plating and method of preparation of ci Adhesive for electroless plating and method of preparation of ci

1989-05-25

1991-06-04

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523428, 525407, 525396, C08G 5922, C08G 5942

Patent

active

050214721

ABSTRACT:
An adhesive for electroless plating is composed of at least one kind of fine powders selected from either a cured heat resistant resin or an inorganic material and easily soluble in a predetermined solution and a heat resistant resin solution sparingly soluble in the predetermined solution by curing treatment. The adhesive for electroless plating in which the above fine powders are dispersed in the above uncured heat resistant resin solution, is coated on a circuit board, dried and cured to form an adhesive layer. When the above predetermined solution contacts with the surface of the adhesive layer, its surface is roughed to be formed a plating film having an excellent adhesiveness by electroless plating.

REFERENCES:
patent: 3356624 (1967-12-01), Neal et al.
patent: 4216246 (1980-08-01), Iwasaki et al.
patent: 4365043 (1982-12-01), Konishi et al.
patent: 4510276 (1985-04-01), Leech et al.
patent: 4524181 (1985-06-01), Adam et al.

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