Adhesive for electroless plating and method of preparation of ci

Details Adhesive for electroless plating and method of preparation of ci Adhesive for electroless plating and method of preparation of ci

1986-05-08

1988-06-21

Newsome, John H.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427306, B05D 512, B05D 304

Patent

active

047524995

ABSTRACT:
An adhesive for electroless plating is composed of at least one kind of fine powders selected from either a cured heat resistant resin or an inorganic material and easily soluble in a predetermined solution and a heat resistant resin solution sparingly soluble in the predetermined solution by curing treatment. The adhesive for electroless plating in which the above fine powders are dispersed in the above uncured heat resistant resin solution, is coated on a circuit board, dried and cured to form an adhesive layer. When the above predetermined solution contacts with the surface of the adhesive layer, its surface is roughed to be formed a plating film having an excellent adhesiveness by electroless plating.

REFERENCES:
patent: 3672937 (1972-06-01), Kallrath et al.
patent: 3686017 (1972-08-01), Menikheim et al.
patent: 4448836 (1984-05-01), Gatzschmann et al.
patent: 4457952 (1984-07-01), Kawamoto
patent: 4552626 (1985-11-01), Stevenson
patent: 4643798 (1987-02-01), Takada et al.

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