Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-10-05
1995-09-26
Jones, W. Gary
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
1562724, 252511, 252513, B32B 2720
Patent
active
054531489
ABSTRACT:
An uniaxial adhesive for connecting a circuit member having a plurality of laterally spaced conductive terminals to a substrate including a mounting space having a plurality of laterally spaced conductive paths contains at least 10 percent by weight of compressible hollow conductive particles and a nonconductive polymeric resin. Magnetic field and pressure are applied to the adhesive to gather, concentrate and deform the hollow conductive particles between the conductive terminals and the conductive paths so as to assure excellent electrical connections therebetween.
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Deng J. C.
Liao Dick
Lu Neng-Hsing
Yang Ning
De Simone Mark
Industrial Technology Research Institute
Jones W. Gary
United Microelectronics Corp.
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