Adhesive film for underfill and semiconductor device using...

Details Adhesive film for underfill and semiconductor device using... Adhesive film for underfill and semiconductor device using...

2006-03-28

2006-03-28

Boykin, Terressa (Department: 1711)

Stock material or miscellaneous articles

Composite

Of polyimide

C257S200000, C428S411100, C528S044000, C528S051000, C528S170000

Reexamination Certificate

active

07018718

ABSTRACT:
An adhesive film for underfill excellent in relaxation effect of the stress generated in the above semiconductor element and the wiring circuit board and in the connecting electrode parts and also excellent in reliability of electrical connection between the semiconductor element and the wiring circuit board.

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European Search Report dated Jul. 28, 2004.

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