Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
C428S458000, C428S473500, C428S901000, C528S044000, C528S045000, C528S052000, C528S310000, C528S322000, C257SE21503
An adhesive film for underfill which relaxes the stress formed in the wiring circuit substrate, semiconductor element and electrode parts for connection. The adhesive film is a quickly hardening type, and forms a highly heat resistant sealing resin layer quickly between the wiring circuit substrate and semiconductor element of a semiconductor device.
patent: 4353954 (1982-10-01), Yamaoka et al.
patent: 5916675 (1999-06-01), Komoto et al.
patent: 6143409 (2000-11-01), Komoto et al.
patent: 6492484 (2002-12-01), Misumi et al.
patent: 6652688 (2003-11-01), Matsumura et al.
patent: 20030034128 (2003-02-01), Matsumura et al.
patent: 20030068841 (2003-04-01), Matsumura et al.
patent: 991306 (2000-04-01), None
patent: 2000013025 (2000-01-01), None
patent: 2000204157 (2000-07-01), None
Nitto Denko Corporation
Adhesive film for underfill and semiconductor device using... does not yet have a rating. At this time, there are no reviews or comments for this patent.If you have personal experience with Adhesive film for underfill and semiconductor device using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive film for underfill and semiconductor device using... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3426555