Adhesive film for underfill and semiconductor device using...

Details Adhesive film for underfill and semiconductor device using... Adhesive film for underfill and semiconductor device using...

2005-01-25

2005-01-25

Stein, Stephen (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S458000, C428S473500, C428S901000, C528S044000, C528S045000, C528S052000, C528S310000, C528S322000, C257SE21503

Reexamination Certificate

active

06846550

ABSTRACT:
An adhesive film for underfill which relaxes the stress formed in the wiring circuit substrate, semiconductor element and electrode parts for connection. The adhesive film is a quickly hardening type, and forms a highly heat resistant sealing resin layer quickly between the wiring circuit substrate and semiconductor element of a semiconductor device.

REFERENCES:
patent: 4353954 (1982-10-01), Yamaoka et al.
patent: 5916675 (1999-06-01), Komoto et al.
patent: 6143409 (2000-11-01), Komoto et al.
patent: 6492484 (2002-12-01), Misumi et al.
patent: 6652688 (2003-11-01), Matsumura et al.
patent: 20030034128 (2003-02-01), Matsumura et al.
patent: 20030068841 (2003-04-01), Matsumura et al.
patent: 991306 (2000-04-01), None
patent: 2000013025 (2000-01-01), None
patent: 2000204157 (2000-07-01), None

Affiliated with

Also associated with

Rating

Adhesive film for underfill and semiconductor device using... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesive film for underfill and semiconductor device using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive film for underfill and semiconductor device using... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3426555