Adhesive film for underfill and semiconductor device using...

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0


C428S458000, C428S473500, C428S901000, C528S044000, C528S045000, C528S052000, C528S310000, C528S322000, C257SE21503

Reexamination Certificate



An adhesive film for underfill which relaxes the stress formed in the wiring circuit substrate, semiconductor element and electrode parts for connection. The adhesive film is a quickly hardening type, and forms a highly heat resistant sealing resin layer quickly between the wiring circuit substrate and semiconductor element of a semiconductor device.

patent: 4353954 (1982-10-01), Yamaoka et al.
patent: 5916675 (1999-06-01), Komoto et al.
patent: 6143409 (2000-11-01), Komoto et al.
patent: 6492484 (2002-12-01), Misumi et al.
patent: 6652688 (2003-11-01), Matsumura et al.
patent: 20030034128 (2003-02-01), Matsumura et al.
patent: 20030068841 (2003-04-01), Matsumura et al.
patent: 991306 (2000-04-01), None
patent: 2000013025 (2000-01-01), None
patent: 2000204157 (2000-07-01), None


Say what you really think

Search for the USA inventors and patents. Rate them and share your experience with other people.


Adhesive film for underfill and semiconductor device using... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesive film for underfill and semiconductor device using..., we encourage you to share that experience with our community. Your opinion is very important and Adhesive film for underfill and semiconductor device using... will most certainly appreciate the feedback.

Rate now


Profile ID: LFUS-PAI-O-3426555

All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.