Adhesive film for stacking semiconductor chips

Details Adhesive film for stacking semiconductor chips Adhesive film for stacking semiconductor chips

2011-06-14

2011-06-14

Chevalier, Alicia (Department: 1788)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C428S343000, C428S3550RA, C428S3550EP

Reexamination Certificate

active

07960023

ABSTRACT:
There is provided an adhesive film for stacking semiconductor layers of chips comprising: a first adhesive layer comprising phenoxy resin, epoxy resin and phenol resin; a second adhesive layer comprising phenoxy resin and an ultraviolet ray curable compound; and a third adhesive layer comprising phenoxy resin, epoxy resin and phenol resin, wherein the second adhesive layer is disposed between the first adhesive layer and the third adhesive layer.

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Sim, Chang-Hoon et al. “Adhesive Film for Semiconductor Chip Lamintion”, abstract of JP 2008-227455A, published on Sep. 25, 2008.

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