Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-08-30
2011-08-30
Lebentritt, Michael (Department: 2829)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S118000, C257S782000, C257S789000, C257SE21506, C257SE23119, C522S182000
Reexamination Certificate
active
08008124
ABSTRACT:
An adhesive film for a semiconductor containing an (A) ester (meth)acrylate copolymer and a (B) thermoplastic resin other than the ester (meth)acrylate copolymer, and composed so as to satisfy the following formula (1) for two hours from 10 minutes after starting measurement, in which γ represents an amount of shearing strain produced upon undergoing a shearing stress of 3000 Pa at a frequency of 1 Hz and a temperature of 175° C. on parallel plates of 20 mm in diameter, exhibits superior filling performance in surface unevenness of a substrate through an encapsulating material sealing process, despite that semiconductor chips are stacked in multiple layers in the semiconductor device and hence a wire bonding process imposes a longer thermal history.in-line-formulae description="In-line Formulae" end="lead"?0.10≦γ≦0.30 (1)in-line-formulae description="In-line Formulae" end="tail"?
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Ditthavong Mori & Steiner, P.C.
Lebentritt Michael
Sumitomo Bakelite Co. Ltd.
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