Adhesive film and use thereof

Stock material or miscellaneous articles – Composite – Of metal

Reexamination Certificate

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Details

C428S457000, C428S473500, C264S241000

Reexamination Certificate

active

07858200

ABSTRACT:
Disclosed in an adhesive film which enables to obtain a flexible metal clad laminate which is suppressed in dimensional change when produced by heat roll lamination. Such an adhesive film comprises a heat-resistant layer containing a highly heat resistant polyimide and an adhesive layer which is formed on at least one surface of the heat-resistant layer and contains a thermoplastic polyimide. In this adhesive film, the thermal shrinkage ratio in the TD direction is not less than +0.01%, and the thermal shrinkage ratio in the MD direction is not more than −0.02%. Consequently, when a metal layer and the adhesive film are bonded together by heat roll lamination and the resulting laminate is subjected to a treatment with heating, occurrence of dimensional changes can be sufficiently suppressed.

REFERENCES:
patent: 5849397 (1998-12-01), Kohno et al.
patent: 7267883 (2007-09-01), Fujihara et al.
patent: 2001/0055691 (2001-12-01), Yamamoto et al.
patent: 57-41330 (1982-09-01), None
patent: 9-199830 (1997-07-01), None
patent: 10-77353 (1998-03-01), None
patent: 2001-164006 (2001-06-01), None
patent: 2001-270034 (2001-10-01), None
patent: 2002-326280 (2002-11-01), None
patent: 2002-326308 (2002-11-01), None
patent: 2003-335874 (2003-11-01), None
patent: 561100 (2003-11-01), None
International Search Report for PCT/JP2005/013324 mailed Nov. 22, 2005 (2 pages).
Patent Abstracts of Japan 2001-270034 dated Oct. 2, 2001 (1 page).
Patent Abstracts of Japan 2001-164006 dated Jun. 19, 2001 (1 page).
Patent Abstracts of Japan 2003-335874 dated Nov. 28, 2003 (1 page).
Patent Abstracts of Japan 56-118421 dated Sep. 17, 1981 (1 page).
Chinese Office Action for Chinese Application No. 200580025423.8, mailed on Mar. 27, 2009 (11 pages).
Patent Abstracts of Japan for Japanese Publication No. 09-199830, Publication Date Jul. 31, 1997 (1 page).
Partial Translation for Japanese Publication for Unexamined Patent Application No. 9-199830 (2 pages), Jul. 31, 1997.
Patent Abstracts of Japan for Japanese Publication No. 2002-326280, Publication Date Nov. 12, 2002 (1 page).
Partial Translation for Japanese Publication for Unexamined Patent Application No. 2002-326280 (2 pages), Nov. 12, 2002.
Patent Abstracts of Japan for Japanese Publication No. 2002-326308, Publication Date Nov. 12, 2002 (1 page).
Partial Translation for Japanese Publication for Unexamined Patent Application No. 2002-326308 (2 pages), Nov. 12, 2002.
Patent Abstracts of Japan for Japanese Publication No. 10-077353, Publication Date Mar. 24, 1998 (1 page).
Patent Abstracts of Japanese Publication No. 2001-270034 dated Oct. 2, 2001 (1 page) (Previously Cited).
Partial Translation for Japanese Publication for Unexamined Patent Application No. 2001-270034 (2 pages), Oct. 2, 2001.
Notification of Transmittal of Copies of Translation of the International Preliminary Report on Patentability (Chapter I and Chapter II of the Patent Cooperation Treaty) (5 pages), Jan. 30, 2007.

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