Adhesive exhibiting maximum melt viscosity of 10,000 Pa s at...

Details Adhesive exhibiting maximum melt viscosity of 10,000 Pa s at... Adhesive exhibiting maximum melt viscosity of 10,000 Pa s at...

2007-02-15

2010-10-26

Sellers, Robert (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C428S413000, C523S457000, C523S458000, C523S468000, C525S423000

Reexamination Certificate

active

07820742

ABSTRACT:
Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at a temperature of 100° C. to (T+30)° C. that is within a range from 100 to 10,000 Pa·s (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.

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